PCB types and Applications

1.       Rigid-Flex Board

Technical Features:

·       Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as cameras (static application).

·       Electrical connections where the assembly is required to flex during its normal use, such as folding mobile phones (dynamic application).

·       Electrical connections between sub-assemblies to replace wire harnesses, which are heavier and bulkier, such as in cars, rockets and satellites.

·       Electrical connections where board thickness or space constraints are driving factors.

Products Details:

Material:                                  FR-4+PI
layer count
                           6 layer
Board Thickness:                    1.60mm
Min Line/Space:                      outer Layers:0.09/0.09mm
                                                Inner Layers:  0.075/0.075mm
Min Hole Size:                         0.2mm

Surface Treatment:                  Immersion Gold

2.      HDI Borad

Technical Features:

The HDI Board has finer lines and spaces, smaller VIAS and capture pads, and higher connection pad density than employed in conventional PCB technology.  HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.

Products Details:

Material:                                  FR-4+RCC
layer count
                          10 layer
Board Thickness:                    1.60mm
Min Line/Space:                      outer Layers:0.1/0.1mm
                                               inner Layers:  0.075/0.075mm
Min. Hole Size:                        0.125mm

Surface Treatment:                 Immersion Gold

3.      Heavy Copper Board

Technical Features:

Heavy copper PCBs are used for multiple purposes such as in planar transformers, heat dissipation, high power distribution, power convertors, etc. There is being increased in demand for heavy copper-clad boards in computer, automotive, military, and industrial controls. Heavy copper printed circuit boards are additionally used in:

Products Details:

• Power supplies, power converters
• Power distribution
• Welding equipment
• Automotive industry
• Solar panel manufacturers, etc.


4.      Mix-material Board

Products Details:

18 layer mix-material board

Material:                                  RO4350B+FR-4 High TG
Board Thickness:                    2.2mm
Min. Line/Space:                     outer Layers:0.1/0.1mm
                                                Inner Layers:  0.08/0.08mm
Min Hole Size:                         0.25mm
Surface Treatment:                 Immersion Gold


5.      Blind Buried Board

Technical Features:

A blind via connects exactly one outer layer with one or more inner layers. A buried via is a via between at least two inner layers, which is not visible from the outer layers. The advantage of Blind and Buried Board is that this technology offers a viable design technique to help meet the density constraints of lines and pads on a typical design without increasing the layer count or board size. 

Product details:

Material:                                  FR-4 Tg180
Board Thickness:                    2.0mm
Min Line/Space:                      0.127/0.127mm
Min Hole Size:                         0.25mm
Surface Treatment:                 Immersion Gold

6.      High frequency Board

Technical Features:

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer build-up, and the dielectric constant (er) of the materials used.

Product Details:

Material:                      PTFE
Surface Treatment:     Immersion Gold

7.      Metal-Base Board

7.1  Cu-Base Board

Technical Features:

Cu-base Board has very good heat dissipation property. It is ideal for high frequency or large temperature variance environment application. Cu-base also use in dedicate communication equipments and building industry.


Products Details:

Material:                      Cu-Base+PTFE
Board Thickness:        1.20mm
Surface Treatment:     Immersion Gold


7.2  AL- Base Board

Aluminium PCB, also named aluminum base PCB, metal clad(MCPCB) PCB, insulated metal substrate(IMS or IMPCB) PCB, thermally conductive PCBs, etc., it is ideally suited for the mounting of high power light emitting diodes (LEDs) easily dissipating the heat generated by power devices.

Products Details:

Material:   AL-base+PTFE
Board Thickness:   3.20mm
Control Depth tolerance:   +/-0.025mm
Surface Treatment: Immersion Gold and anode Oxidation

8.      Gold Board

12 Layer Gold Board

Products Details:

Layer Count: 12

Material: FR4

Board thickness: 5.0mm

Min Line/Space: 0.2/0.2mm

Min hole size: 0.6mm

Surface finish: Imm gold

9.      Backplane Board

10 Layer Backplane Board

Backplanes are normally used in preference to cables because of their greater reliability. In a cabled system, the cables need to be flexed every time that a card is added or removed from the system; this flexing eventually causes mechanical failures. A backplane does not suffer from this problem, so its service life is limited only by the longevity of its connectors. 

Products Details:

Layer Count:               10
Material :                     FR4
Board thickness:         3.5mm
Min Line/space:           0.127/0.127mm
Surface finish:             LF-HASL

10.  Gold Finger Board


Gold Fingers board is a PCB has a gold-plated terminal of a card-edge connector, usually, fingers are done by flash gold (hard gold) and the gold thickness is requested to be from 3u`` to 50u`` because fingers are mainly used for pluging for many times.

Product Details:

Layer count:               16
Material:                      FR4
Board thickness:         2.0mm
Min Line/Space           Outer: 0.1/0.1mm             
                                    Inner: 0.075/0.075mm
Min hole size :             0.2 mm

Surface treatment:      LF-HASL +Gold finger